ESF-Series
Thin EMI Shielding Sheet for Electronic Compinents
Features
- Excellent OSP and acid resistance
- Shielding material is a Ag-Cu composite material
- Shielding property and Flexibility are same as existing product
- Flex-rigid board and muli-layer FPC
Structure
Properties
| Thickness(㎛) | Surface Resistance (Ω/□) | Linear Resistance (Ω/5cm) | Pre-Bonding Strength (Kgf/cm) | Main Bonding Strength (Kgf/cm) |
|---|---|---|---|---|
| 20±2 | Max. 0.50 | Max. 8 | Min. 2.0 | Min. 3.0 |
Storage Method
- Room temperature storage(5~20℃ / RH 20%)
Application
- Flex-rigid board and multi layer FPC
