TICF-600
Electrically Conductive Bonding Sheet for Electronic Components.
Features
- StrengtheningGND
- Applicableto Pb-FreeReflow-soldering
- Outstanding adhesion to stiffener(SUS,FR-4,PI)
- Excellent conductivity based on Ag-Cu
Properties
Storage Method
| Thickness(㎛) | Surface Resistance (Ω/□) | Linear Resistance (Ω/5cm) | Pre-Bonding Strength (Kgf/cm) | Main Bonding Strength (Kgf/cm) |
|---|---|---|---|---|
| 60±5 | Max. 0.30 | Max. 1.5 | Min. 0.2 | Min. 1.0 |
Storage Method
- Room temperature storage(5~10℃ / RH20%)
Application
- Camera module (mobilephone, game machine, laptop, etc.)
